Xe and esports gaming on Tiger Lake Thread. Comments welcome.
I'm seeing a lot of reviews saying that Tiger Lake with Xe will be a boon for esports gamers, and then comments that integrated graphics is still high on the steam survey, so win win. /1
Everything that Intel has said about TGL, with it being on the premium 10SF process, with the leading generation CPU/GPU and TB4 and Athena/Evo, these ultra premium systems will not be priced for that 'casual gaming' market that plays on integrated graphics. /2
Those that game are more likely to spend that $1200+ on a gaming laptop with a 1660 Ti or something. The ultra portable is more for the worker and the road warrior. /3
If you wanted to take a lead in IGP gaming, you'd need to have 96 XeLP EUs in a Core i3 or Atom. Those Core i3 parts have half the EUs to the 1185G7 tested today at lower freq, and thus much reduced perf /4
When the TGL devices come to market, depending on how many and in what form factors, match up something like a $600 TGL with a $600 Renoir. Acer and others really like that price point. /5
That being said, I did see an Ice Lake i7-1065G7 in a terrible 15 inch HP 1366x768 TN single channel system once, for under $600. 🤪 /6
Imagine if Intel built a Core i7 but with lower clocks and 96 EUs just for gaming for that $600 market. They could call it the Core i7-1185GG. GGWP /7
• • •
Missing some Tweet in this thread? You can try to
force a refresh
Ready for @intel #vision keynote with new CEO Lip-Bu Tan? Lots of eyes on this one. Starts on the hour. A 🧵
Some initial thoughts. LBT has to show he understands the company. He needs to showcase where Intel stands in key markets, and identify the direction to go in. If Pat was the aspirational, LBT has to be the pragmatist, and show it.
He's only been the role a month. I'm not expecting any major announcements or immediate changes in Intel's direction right now. He has some time for that for sure. LBT has to show how sharp he is, where he's focused, and what matters most.
Short Course 1 from #iedm24 today. TSMC giving some detail about the state of the industry. Some highlights.
#1 3D Stacking is expected to go to 3 micron pitch by 2027.
#2 A16-based AI accelerators in 2027 with CoWoS-L and 12xHBM4. But even those 2025/2026 designs look cool - six compute die, 12xHBM3e. Next gen MI400 from AMD maybe?
#3 WiFi 8 to show life in 2027/2028. WiFi 8 at 10 Gbps may need as much as 30 TOPs and TSMC N4 to achieve peak perf. Could do it in N16, but big chip with lots of power.
Sucks that still so much WiFi 4 will still be being installed.