Thread of slides from Tokyo Electron IR day I thought were interesting
Everyone is pushing the same narrative rn

Digital x Green this is same as INFN IR day

Everyone also is putting forward a "new golden age of semis and WFE" - acceleration baby
For those who don't know what Tokyo Electron does - Coating - cleaning - some etch - some deposition - and prober.

Think of them as number 2 in Etch / Deposition behind LRCX / AMAT

Coating (photoresist coating) is their bread and butter and they have a lot of units.
Interesting - I have *never seen this chart* before. I guess they are safe AF - but jives w/ TEL's reputation for being an amazing engineering company + amazing service.
I don't know why but i found this slide funny?

The advantage is that they don't got semis - so you could prob buy one during this outage 🤣🤣
you have your cars, your phones, your internet of things, but did you know... about the internet of ANIMALS?
I like this slide - roadmap for the next 10 years being

AI - crazy system design w/ hybrid devices and massive specialization

Server - try to extend moore's

IOT - Lagging edge and legacy. NICE!
Breaks down Logic / Memory / BEOL (back end of line) / System integration options.

Pretty cool imo - each has a different roadmap than before which used to be just shrink it.
This logic roadmap is awesome. Where we go post GAA NS - all the way to CFET (complimentary FET)
GAA is way more complex. You knew that - I knew that - but this is an example that looks pretty intense.

some modules that enable this - also uhm am i insane but that looks like a lot more etch than the previous generations.
wafer bonding's future importance - talk about advanced packaging lol
note the 5x increase in HBM for GPU and 4-6x in phones - memory bulls be delighted.
anyways - rolling it all up.

Everything else being equal - 100k WSPM has been going up.
TEL talking up their coater - 100% share in EUV resist

I'm really interested in the Metal Oxide Resist portion of this
Seems to be pushing MOR - superior tech to dry resist process (yo watch out LRCX)

this is a bit too technical for me to really call out a winner lol.
This slide is really interesting - compensation by etch technology becomes important as EUV pretty much becomes harder to manage
There are a lot more things that I think are technically interesting - so you should just check out the slides for yourself.

tel.com/ir/policy/mpla…

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