#OCPSummit22 kicking off. First keynote by Intel
"We have an amazing track record of improving energy efficiency" - @intel Zane Bell
Umm...
He's talking about datacenters, but Moore's law slide here is a bit funny given the history.
The bit on server resilience is very important.
Intel is releasing a spec for immersion cooling, and will offer warranty too
"Air is running out of steam. It's time to embrace immersion cooling" - @intel Zane Bell
"More energy in immersion cooling than ever, the time is now" #OCPSummit22
Up next at #OCPSummit22 is @Meta
They do 90M AI inference per second for Instagram!
Their models are massive but compute is not as high for DLRMs due to continuous and categorical features stored in embedding tables. @OpenComputePrj
@Meta are announcing Grand Teton which is their new AI server.
Looks like it has 8x A100 PCIe not SMX?
Not sure what CPU. #OCPsummit22
New open rack v3 at @OpenComputePrj
48V
Up to 20kW
Flexible in what type of servers it supports.
Can support 300% transients! #OCPSummit22
@Meta also talking about the issues in model training.
The interconnects aren't scaling and that leads to as much as 57% of time spent waiting for networking in model training
Discussed this in the article linked #OCPSummit22 semianalysis.com/p/meta-discuss…
@Meta is re-presenting these slides, but networking is taking most the bandwidth and accelerators will need 1TB/S of accelerator to accelerator IO with a purpose built non-blocking fabric.
Discussed in linked article. semianalysis.com/p/meta-discuss… #OCPSummit22@OpenComputePrj
Datacenters used 1% to 1.5% of worldwide power in 2020.
By 2030, datacenters will consume 3% to 13% of worldwide power generation! #OCPSummit22@OpenComputePrj
"More compute with less power" - @jwittich is the goal for @AmpereComputing
They project in 2025, Ampere servers using @Arm ISA will require less than half the power + area as "legacy" x86 based servers.
Rack density, scalability, utilization rates, noisy neighbors #OCPSummit22
Some harder figures and claims from @AmpereComputing@jwittich
Power efficiency in NGINX, 3.8x vs Icelake
Much more consistent performance, nearly no noisy neighbors
Scales near linearly in perf
Standard 12.8kW rack, more than double the cores and 2x the performance #OCPSummit22
@AmpereComputing is now announcing their next generation Siyrn based platforms.
They support 2U, 2P, using DDR5 2DPC and PCIe 5.0, based on the Siyrn architecture which we detailed exclusively at SemiAnalysis! @jwittich@OpenComputePrj#OCPSummit22
Next up is @Broadcom talking about Ethernet, the leader in Ethernet switches.
~600M Ethernet ports are shipped annually.
4x as many Ethernet ports as people board each year. #OCPSummit22@OpenComputePrj
"Basically give every newborn 4 ethernet ports when they are born and say happy birthday! Try that with Infiniband, so expensive it would exceed world GDP"
This was funniest thing I've heard in a keynote ever
Broadcom savage on stage about @nvidia@NVIDIANetworkng #OCPSummit22
Infiniband used to be far lower latency, but less flexible.
Broadcom is talking up their advancements with HPC Ethernet bringing the latency gap to 0.
The data they presented is from Los Alamos National Lab @LosAlamosNatLab #OCPSummit22
Now talking about transient over subscription, flow collisions, and incast overload.
Addressing these quenes and load balancing is critical to maintain low latency. #OCPSummit22
Broadcom acquired a new company to help with these issues.
They will maintain Ethernet leadership
Incast can be solved by drop congestion notification aka packet trimming.
Transient congestion with packet spraying
In network telemetry can help buffer packets #OCPSummit22
@Meta head of networks on stage talking about closer collaboration with @Broadcom
Mentioned lots of open software and copackaged optics.
Does this mean that @AristaNetworks software, a huge shipper of Broadcom silicon based in switch boxes to Meta, now going to be dropped?
$ANET
Caliptra being announced by @Google alongside @Microsoft@AMD@nvidia
No Intel included is noteworthy.
Trusted computing IP will be hardened in silicon at the chip level and package level.
This seems huge! #OCPSummit22
Caliptra is going to be HUGE
For confidential compute so cloud tenants can trust their data and code is secure even from the cloud providor.
It's an open source root of trust.
Reusable silicon block designed into many chips and validates their trustworthiness.
Wow #OCPSummit22
Caliptra specifications, RTL, and firmware which is written in trust is open. 0.5 released.
It's part of @OpenComputePrj and the @linuxfoundation chips alliance.
Microsoft has a live demo here at the conference. AMD, Microsoft, Nvidia, and Google supporting it. #OCPSummit22
Microsoft and Nuvoton are releasing a new root of trust engine for BMCs too.
Integrated security system.
Determines what BMC can access on a debug requests.
TPM functionality.
Can ensure that BMCs are not modified! #OCPSummit22
Project Kirkland announced.
Partnership with Microsoft, Google, Intel, Infineon.
Currently Infineon chip, but will be open sourced.
Trust for TPM and prevent physical bus and interconnect attacks. #OCPSummit22
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TSMC Q4 2022 Earnings Thread
Record numbers, but all eyes are on utilization rates and capital spending guidance for 2023.
TSM came in on the low end of previous guidance for revenue due to utilization issues from economic weakness. $TSM
Margins were above guidance, primarily due to foreign exchange changes. TSMC specifically cited utilization rates as a bit of a drag.
N5 and N7 grew in 2022, but there is some weakness now.
Q4 had a slight decrease in wafer shipments year on year, but huge ASP increases from N5
Smartphone is only slightly down, but TSMC says end market will go down more
Intel earnings thread /1
Datacenter and AI group did totally horribly...
Literally no operating profit.
The worst quarter in the last couple of decades of the history of datacenter.
$INTC $AMD $TSM $NVDA $MRVL
The guide down on Q4 is immense!
Q1 $18.4B Revenue, $1.98 EPS
Q2 $15.3B Revenue, -$0.11 EPS
Q3 $15.3B Revenue, $0.25 EPS
Q4 $14.5B Revneue, -$0.01 EPS
The business is imploding.
Nice way to announce cost cuts/layoffs
“As we usher in the next phase of IDM 2.0, we are focused on embracing an internal foundry model to allow our manufacturing group / business units to be more agile, make better decisions / establish a leadership cost structure”
David Zinsner
The story of Cormac, an African American mechanical engineer who has done everything he's supposed to, but been screwed over by life and our American system.
He doesn't want a handout, just a job.
Please read, like, and retweet this thread.
Reach out if you can help!
1/13
Cormac did everything right in life, everything our society says.
He took dual enrollment and AP classes in high school.
He went to a state university with a scholarship + job that covered a chunk of the costs.
He chose to pursue mechanical engineering at a top 50 school!
2/13
Cormac even secured himself an apprenticeship and masters degree position at a top industrial firm in Germany after he graduated.
Cormac also had many hobbies aswell. He loved to bike, cars (electric vehical engineering), sports, computer hardware, clean energy, and more.
3/13
Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable?
Deep dive on Tower Semiconductor Fabs/IP
Intel Culture Shift
Future Product And Roadmap Competitiveness By Business Unit
$INTC $TSM $TSEM $NVDA $AMD $MRVL $AMAT $ASML $LRCX $KLA semianalysis.substack.com/p/intel-is-thr…
I mapped out Tower Semiconductors capacity. I also wrote a lot about their specific differentiated technologies.
In short, Intel acquired ~2 million wafers per year of a lot of niche technologies and great people to help accelerate their foundry push.
$INTC $TSEM $TSMC $UMC $GFS
I also wrote a lot about the culture shift at Intel, including a really great story about Intel and how they treated various semicap firms (poorly).
This specific story is Applied Materials, but tons of other horror stories I've heard the supply chain
$INTC $AMAT $LRCX $ASML $KLA
The story about Alibaba/THead 5nm Arm server chip is more complicated than it seems!
$BABA/Chinese media say in-house independent design
Taiwan media has said it uses a Taiwan based design house
The theory is it's externally designed to get around IP restriction.
/1
$NVDA $SFTBY
On first glance, stellar specs. SpecInt score matching the best current chips from AMD and demolishing Intel.
2 die package with 60B transistors!
64KB+64KB L1 cache, 1MB L2 cache, 128MB L3 cache
8 channel DDR5 4400, 96x lanes PCIe 5.0
2.75-3.2GHz, 250W TDP
Damn impressive!
2/
So @Stewrandall pointed out that Arm seems excited on their social media, but the Arm China WeChat account has said nothing.
That seems really odd?!?!
Arm China should be hailing this. Are they not involved?
That seems possible given it's gone rogue.
/3
The new Macbook Pro's are HALF as efficient as the Macbook Air/Pro 13" in web browsing!
Battery life is a massive improvement over the successor, but efficiency is down quite a bit compared to these original M1 Macs.
Part of this is due to screen differences, part due to SOC/mem.
With the die shots Apple released. I think there are some errors in it.
Using them for face value, @Locuza_ + @andreif7 calculated die sizes:
M1 Pro 245.08-245.92mm^2
M1 Max 429.17-432.35mm^2
Both noticed some these, but it should be
M1 Pro 241.7mm^2
M1 Max 383.5mm^2
Why the discrepancy?
The Firestorm CPU core, GPU cores, and 11 TOPs NPU are all scaled larger.
If they were scaled the same as real die shots of M1, then those would be the die sizes.
Both @Locuza_ and @andreif7 noticed this odd scaling btw