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Jul 18 8 tweets 2 min read
Similar to DeepSeek in January 2025, Panicans may think that the AI networking switch TAM will massively shrink because Kimi K3 uses KDA Attention, which reduces KV-transfer networking bandwidth by up to 10x. But the opposite is true, as we explain below. 👇️ 1/8🧵 Image While it is true that Kimi K3 uses Kimi Delta Linear Attention (KDA) in 3 out of every 4 layers and that KDA reduces KV-cache transfer bandwidth by up to 10x compared with comparable full global-attention models, the important missing piece is that Kimi K3 requires WideEP to serve. 2/8🧵Image
Jul 18 8 tweets 3 min read
MASSIVE DELAY ALERT TO ORACLE’S STARGATE SITE AND BLOOM ENERGY🚨🚨

Oracle’s Project Jupiter behind-the-meter datacenter project in New Mexico that plans to use Bloom Energy is at risk of a 1-2 year delay due to permitting and pipeline building blockers. (1/8)🧵 Image As we continue to monitor the status of datacenter delays, whether they are real, whether they are fake... some are out and out delayed because of -> building gas pipelines and receiving permits for power generation equipment. (2/8)
Jul 17 8 tweets 3 min read
Similar to the panic over DeepSeek R1, some uneducated people think Kimi K3’s use of linear attention (KDA) is bad for NVIDIA, HBM, DRAM, and networking because it has relatively lower KV-cache requirements. The opposite is true, and we explain why below. 👇️ 1/8🧵 Image Kimi K3 is actually quite positive for NVIDIA, as large-model inference is where the NVL72 shines. Because K3 has more than 2.8 trillion parameters, it requires a large scale-up domain to store its weights. 2/8🧵 Image
Jul 13 10 tweets 4 min read
On Feb 28th 2026, the United States launched Operation “Epic Fury” against Iran.

Markets and media were caught off guard, but careful and diligent observers were hardly surprised.

The signals sat in plain sight for weeks, you just had to know where to look. A thread on OSINT — and why we run some of our research the same way. (1/10)🧵Image Before the first strike ever came down on Tehran, OSINT accounts right here on this platform were tracking the military buildup in the Middle East in near real time.

Here for example one could see how leading up to the 28th, 333 (at a minimum) C-5 and C-17 transport aircraft flights were recorded leaving US bases towards the Middle East theater. (2/10)

x.com/ArmchairAdml/s…
Jul 7 8 tweets 2 min read
TSMC’s moat is bigger than PPA, EUV, or yield. It is the EDA/IP ecosystem wrapped around the fab. (1/8)🧵 Image TSMC’s Open Innovation Platform has turned Synopsys, Cadence, Arm, Rambus, Alphawave, and dozens of IP vendors into a pre-validated tape-out network. And that moat is measurable. (2/8)
Jul 6 7 tweets 3 min read
With the recent surge in AI mega clusters, reaching hundreds of thousands to millions of AI accelerators, cloud providers encountered a new set of challenges that forced them to run chip interconnect at a new scale: interconnecting multiple datacenters together. This is called scale-across. (1/7)🧵Image Scale-across has been widely popularized by Nvidia last year, but is now often used imprecisely as a generic term to talk almost about any Datacenter interconnect network. To make it short, scale-across refers to backend datacenter interconnect networks that are used to connect multiple datacenters all together to form a single, coherent cluster. (2/7)Image
Jul 5 6 tweets 2 min read
MASSIVE DELAY: Just 3 months after Jensen demoed Kyber NVL144 at GTC, it has faced major setbacks and has been delayed by more than 12 months, pushing it back to 2028. Below, we explain why Kyber has faced massive delays and why NVIDIA’s NVL72x2 back-to-back rack architecture was also cancelled, leaving Rubin Ultra with a limited scale-up domain. 👇️ 1/6🧵Image Kyber NVL144 rack architecture has been delayed to 2028 as the PCB midplane remains challenging from a manufacturability standpoint. NVL576, which connects 8x Oberon racks over CPO between the NVSwitches, is also likely delayed or restricted to small volumes given the current challenges with CPO. 2/6🧵Image
Jul 3 5 tweets 3 min read
Everyone's always talking about agentic coding harnesses: Claude Code, Codex, OpenCode, Pi... the list goes on. But what's the difference between all of them? What even Is a harness anyway?

In this thread, we'll take a look under the hood. (1/5)🧵 Image It is first helpful to understand how the underlying models work. Opus, GPT 5.5, etc (the models) are all stateless -- they remember nothing between requests. That is, each time you press "enter" at the prompt factory, the harness rebuilds the entire conversation and ships it (this is why prompt caching is so important!). There is no memory sitting on the server. Whatever the model "knows" about your session exists only because the harness packed it into that one request. (2/5)Image
Jul 3 6 tweets 3 min read
This last week JEDEC announced a new standard for SPHBM4: Standard Package High Bandwidth Memory (JESD330-4).

It utilizes the same DRAM stacks as HBM4, but swaps in a different buffer die. The goal? Enable HBM assembly in standard packaging and break the AI Advanced Packaging bottleneck. (1/6)🧵Image The idea is simple: maintain HBM4 performance while drastically reducing the reliance on expensive, supply-constrained advanced packaging.

How? By slashing the pin count to 1/5th but quadrupling signal speeds to 32 Gbps. This allows HBM-level bandwidth using standard substrates, while pushing the connection distance out to 20mm for vastly superior thermal management.
Here is why SPHBM4 is a massive win for the substrate industry: (2/6)Image
Jul 1 4 tweets 2 min read
Google's next TPU, codenamed Humufish, is set to use Intel's EMIB-T instead of TSMC CoWoS.

Nearly every leading AI training accelerator today is packaged on a TSMC 2.5D flow, and almost all of it is CoWoS. CoWoS is the industry default, which is exactly why a flagship part moving off it is worth attention.

The core difference. CoWoS places all dies on a single large silicon/RDL interposer. EMIB embeds small silicon bridges directly in the organic substrate, only where die-to-die links are needed. (1/4)🧵Image So why EMIB?

🟠 EMIB isn't bound by the interposer reticle limit. A CoWoS silicon interposer is printed by lithography, so it is capped by the reticle limit; the monolithic version (CoWoS-S) maxed near 3.3x, which is why TSMC moved to CoWoS-L. EMIB is not bound by the reticle limit, so it’s a much more scalable technology.

🟠 Efficiency and cost. EMIB packaging is meaningfully cheaper, since it drops the costly interposer entirely. EMIB also uses silicon far more efficiently than CoWoS. A wafer is round, so large interposers waste area at the edge and yield worse as they grow, while tiny bridges tile densely with little waste. It also gives buyers a second source outside TSMC. (2/4)Image
Jun 29 4 tweets 1 min read
INTERESTING: Only 3 months after Rubin Ultra was announced at GTC 2026, the original 4-die Rubin Ultra has been cancelled due to manufacturing execution concerns. The new “Rubin Ultra” is half the size/~ half the real-world performance of the original Rubin Ultra. 1/4🧵 Image This all comes against the backdrop of NVIDIA’s market share being eroded by Trainium, TPUs, and AMD chips. For NVIDIA to maintain pole position, it must be aggressive in execution. Manufacturing execution issues like this will only lead to more market share being chipped away. 2/4🧵
Jun 29 6 tweets 3 min read
One of the most underappreciated ways to play the AI semiconductor buildout may be through materials rather than chips themselves.

As the industry races to produce more advanced semiconductors, demand isn’t just rising for GPUs and wafer fab equipment, it’s rising for the critical materials that make modern chips possible. (1/6)🧵Image Tungsten is a great example.

It is one of the most critical materials in semiconductor fabrication, prized for its high-temperature stability and resistance to electrical wear. Fabs rely on CVD to fill the deep, high-aspect-ratio vertical vias that link multi-layered chip architectures, while utilizing PVD to deposit the ultra-thin structural barrier layers surrounding them. Because it spans both core deposition categories, tungsten is completely non-negotiable for advanced chip production. (2/6)Image
Jun 28 7 tweets 2 min read
BREAKING NEWS: The Founder/CEO of LeptonAI has left only a year after LeptonAI’s acquisition. This is quite shocking, as Jensen reportedly spent $700M acquiring LeptonAI. What did he see? DGX Lepton flopped and got nowhere near the success Jensen expected. 1/7🧵 Image Initially, NVIDIA claimed that Lepton’s core software platform would be open-sourced by 2026. That has yet to happen. While we were skeptical, we wanted to believe that NVIDIA would open-source the core Lepton software platform, given that Lepton’s CEO is the co-creator of Caffe, ONNX, and PyTorch. 2/7🧵
Jun 27 4 tweets 2 min read
One of the more uncomfortable observations in our AI Value Capture piece is internal: our token spend at SemiAnalysis now runs at roughly 30% of employee compensation, with employees pulling just under 5 billion tokens per month on average, over 5x more than Meta, and our top contributors clearing 100 billion. We wrote about it openly because every research firm, hedge fund, and law firm we know is heading toward a similar number, just on a delay. (1/4)🧵Image The substitution math is the part to internalize. Tasks that used to need a junior analyst for several hours, converting a model to a dashboard, building chart packs from earnings, rebuilding a comp set, now resolve in minutes for a few dollars of tokens. The blended Opus 4.7 cost we observe is about $0.99 per million against $5/$25 sticker, mostly because agentic workloads run 300:1 input-to-output ratios and cache hit rates above 90% pull the effective price down. Thats a real change in the unit economics of professional services, not a 10% efficiency gain. (2/4)
Jun 26 5 tweets 2 min read
H100 ornn index spot prices are falling, now at $2.42 per hour, roughly 40% below the May peak. The ecosystem is concerned that this is a sign that compute demand and by extension the appetite for AI is waning. (1/5)🧵 Image The important signal is that this is likely a spot price index not term pricing. Our neocloud survey for 1-year H100 contract prices have isntead climbed from a trough of roughly $1.70 per hour late last year to about $2.65 per hour today. (2/5) Image
Jun 22 4 tweets 1 min read
AI demand is outstripping Moore's law in the short run
Moore's law drove import prices of computers and semiconductors down by 52% between 2001 and 2020. (1/4)🧵 Image AI demand has surged so high that import prices for computers and semiconductors rose 3.6% in May, now up 14.4% year-to-year. This is so far from anything in the historical record that 'fastest ever' doesn't do justice to it. (2/4)
Jun 15 10 tweets 4 min read
China is Mogging Western Auto, and that’s Bad for Semis, National Security & War

If you live anywhere outside the US, you've noticed it: the streets are filling up with cars you've never seen before. Chery? Jaecoo? Zeekr? Leapmotor? BYD? No, you didn't miss a decade of car launches. They're Chinese. And they're everywhere. (1/10)🧵Image Israel is the perfect case study to understand what’s really going on: high car ownership, zero domestic production & no restrictions on auto imports from China. Here’s what the data shows:

China's share of Israel's auto import value: 2023: 23.7% 2024: 29.1% 2025: 36.6% 2026 YTD: 40.2. (2/10)Image
Jun 10 4 tweets 2 min read
What's the better business model for an AI lab, subscription or API? (1/4)🧵 Image Recently, we purchased one of each Anthropic/OpenAI subscription plan and randomly ran long horizon coding tasks until we exhausted the weekly limit. It's widely believed that a $200/month plan maxes out at ~$2000/month worth of tokens (assuming API pricing). However, we found that the subscriptions are actually far more generous. (2/4)Image
May 13 10 tweets 2 min read
OSATs are usually seen as “boring” semiconductor companies. But we’ve been, and remain, bullish on Amkor ($AMKR) and ASE ($3711.TW). Why?
Because both sides of the OSAT model, Assembly & Test, are starting to shift in a meaningful way. (1/10) 🧵 Image Let’s focus on the first for now; Assembly.

Historically, packaging = low-margin wire bonding. Not exciting.
ASE once made up ~40% of $KLIC’s wire bonder business. After the COVID boom, capacity flooded the market and growth stalled. (2/10)
May 12 11 tweets 3 min read
Something to watch closely as the war in Iran drags on:

A very obscure part of the semiconductor supply chain, Naphtha, is potentially
becoming a quiet constraint on AI chips. (1/11) 🧵 Image Here is what the supply chain looks like:

An oil called Naphtha is shipped on giant tankers from Middle Eastern countries like Kuwait, UAE and Saudi Arabia by companies like Aramco (Saudi Arabia) or
ADNOC (UAE).

Then Integrated Japanese Chemical companies like Daicel and Toagosei and Korean petrochemical giants like LG Chem or Lotte Chemical "crack" it (break it down) in massive factories to create Propylene gas. (2/11)
May 6 10 tweets 2 min read
Earlier this year, Micron announced it would acquire PSMC’s P5 Tongluo fab in Miaoli, Taiwan—the process has officially begun.

At first glance, this looked like a straightforward legacy logic/memory fab acquisition. But the details worth a close look. (1/10) 🧵 Image The site has two key sections: Section A and Section B.

Section A already exists and is now being converted for likely Micron’s 1b DRAM process. Because it is not EUV-compatible, 1b is a practical fit for the existing cleanroom setup with proper equipment from Micron in coming quarters (the existing legacy equipment are from PSMC and those were not including in the acquisition agreement). (2/10)