"Ongoing shortage of packaging substrates leading to increased adoption of fan-out packaging. ASE, along with AMD, Mediatek and Qualcomm securing beachheads"
"SPIL currently mass producing FOEB for AMD's new HPC product".
When referring to DRAM speed, best to use "Gbps" rather than "GT/s" although in the case of DDRx, they are the same. Avoid "MHz". It is quite simply, wrong.
It amazes me that so many people seem to think TSMC is some simple-minded "EVERYONE'S FOUNDRY", only interested in short term profit maximization.
Come on, think again. TSMC didn't get to where is today by being an opportunistic money grab, sans ability to think strategically.
Modern fabs cost upwards of $10 billion apiece to build. ROI for capital equipment alone is many, many years, not to mention astronomical operating costs on an ongoing basis. If you don't keep those fabs full during it's entire lifetime, you'll go bankrupt pretty damn quick.
Jul 6, 2021 • 7 tweets • 4 min read
> Very interesting analysis of the newly added systems on the Top500 Supercomputer List released at ISC21 by @Patrick1Kennedy.
Another Boring™ Q&A session. Same story, no surprises: on track to stated market share goals, Milan shipping in Q4, new products on track, blah, blah, blah....🙃
"AMD CFO Devinder Kumar at the Bank of America Securities Global Technology Conference"
veracast.com/webcasts/bofa/…
Oh, console fans, in case you're still wondering, both Xbox and PS5 are ramping in 2H as planned.
Jun 3, 2020 • 4 tweets • 1 min read
"PS5 main SoC volume to increase in June, July and August. Delivery from backend packaging and test begins next week. Inventory will keep rising, peaking in Q3."
Chinese article now online:
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