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You can read it here:
Most of the value is HS84718: "Other units of automatic data processing machines."
The 910C is basically two co-packaged Ascend 910Bs, China's best current-gen accelerator. But there's a twist: most (potentially all) of these chips weren't produced domestically—they were illicitly procured from TSMC despite export controls. 2/
Full paper here:
Quick HBM primer: HBM is the most advanced high-performance memory. It’s made by stacking DRAM dies. Only SK Hynix, Micron, and Samsung currently produce it at scale. All current leading data center AI chips use HBM. 2/
As I've highlighted before, there were loopholes in the initial controls. At first glance, these new measures seem to address those. The prior 'escape/scaling path' allowed continued scaling computational performance while bounding the interconnect.https://twitter.com/ohlennart/status/1590413174788227072
They discuss the main difference between LSICS and traditional high-performance computing:
1) We have curated a dataset of 123 milestone ML models.