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Finally, after a long days of analysis, I finished composing yet another mega list of newly published Intel patents. Without a doubt, you will, like me, be surprised by some of the advances and developments achieved.
I will divide this list into 4 parts. Keep in mind that you need to look not only at the patents in the following threads, but also the previous lists to get a complete sense of current developments and what this may result in the near future. Below is the first part!
Patent: Method to enable interposer to interposer connection - Intel

More details: freepatentsonline.com/20190304809.pdf
Patent: Electromigration resistant and profile consistent contact arrays - Intel

More details: freepatentsonline.com/10431537.pdf
Patent: Semiconductor package with embedded optical die - Intel

Just another step towards a true direct processor-to-processor optical interconnect.

More details: freepatentsonline.com/20190302379.pdf
Patent: Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same - Intel

More details: freepatentsonline.com/20190304911.pdf
Patent: Shield to protect vias from electromagnetic interference - Intel

More details: freepatentsonline.com/20190304923.pdf
Patent: Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer - Intel

More details: freepatentsonline.com/20190304784.pdf
Patent: Transistor device with heterogeneous channel structure bodies and method of providing same - Intel

More details: freepatentsonline.com/20190305121.pdf
Patent: Storing cache lines in dedicated cache of an idle core - Intel

More details: freepatentsonline.com/20190303294.pdf
Patent: Nanoribbon structures with recessed source-drain epitaxy - Intel

More details: freepatentsonline.com/20190305135.pdf
Patent: Asymmetrical semiconductor nanowire field-effect transistor - Intel

More details: freepatentsonline.com/20190305085.pdf
Patent: Face-to-Face Through-Silicon Via multi-chip semiconductor apparatus with redistribution layer packaging and methods of assembling same - Intel

More details: freepatentsonline.com/20190304876.pdf
Patent: Fan out packaging pop mechanical attach method - Intel

More details: freepatentsonline.com/20190312016.pdf
Patent: Composite stacked interconnects for high-speed applications and methods of assembling same - Intel

More details: freepatentsonline.com/20190311978.pdf
Patent: Techniques for die tiling - Intel

EMIB over EMIB...

More details: freepatentsonline.com/20190312019.pdf
Patent: Die stack override for die testing - Intel

More details: freepatentsonline.com/20190311960.pdf
Patent: Wrap-around contact structures for semiconductor fins - Intel

More details: freepatentsonline.com/20190311950.pdf
Patent: Microelectronic assemblies having substrate-integrated perovskite layers - Intel

More details: freepatentsonline.com/20190311980.pdf
Patent: Technologies for providing ECC pre-provisioning and handling for cross-point memory and compute operations - Intel

More details: freepatentsonline.com/20190310911.pdf
Patent: Stiffener and package substrate for a semiconductor package - Intel

More details: freepatentsonline.com/20190311963.pdf
Patent: Technologies for performing in-memory training data augmentation for artificial intelligence - Intel

More details: freepatentsonline.com/20190311254.pdf
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